Electromigration testing of interconnect analogues having bottom-connected sensory pins

具有底端连接的感测引脚的互连类似物的电迁移测试

Abstract

The invention relates to an electromigration testing of interconnect analogues having bottom-connected sensory pins. A system for electromigration testing is disclosed. The system includes a conductive member, a cap layer of insulative material over at least a portion of a top surface of the conductive member, a cathode conductively connected to a first end of the conductive member; an anode conductively connected to a second end of the conductive member, and a current source conductively connected to the cathode and the anode. A plurality of sensory pins are disposed along a length of the conductive member between the first end and the second end of the conductive member. The sensory pins are conductively connected to a bottom surface of the conductive member. At least one measurement device is conductively connected to at least one sensory pin of the plurality of sensory pins. The at least one measurement device determines a resistance of at least one portion of the conductive member.
本发明涉及一种具有底端连接的感测引脚的互连类似物的电迁移测试,其揭示一种用于电迁移测试的系统。该系统包括传导构件、位在该传导构件的顶端表面的一部分上方的由绝缘材料构成的覆盖层、传导性连接至该传导构件的第一端的阴极;传导性连接至该传导构件的第二端的阳极、以及传导性连接至该阴极与该阳极的电流源。多个感测引脚沿着介于该传导构件的第一端与第二端之间的传导构件的长度布置。所述感测引脚传导性连接至该传导构件的底端表面。至少一个测量装置传导性连接至该多个感测引脚的至少一个感测引脚。该至少一个测量装置测定该传导构件的至少一个部分的电阻。

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