Wiring board for light emitting element, and light emitting device



【課題】 配線板の凹設穴の底面や壁面及び上面周囲に、部品素子の接続信頼性向上や反射面として金属めっき膜を施すことは、ドリルやルータ加工では凹設穴の内壁や底面の加工面に微細な凹凸が残り発光素子をこの非貫通穴内に搭載させ反射効率を良好に保つことが困難である。 【解決手段】 本発明によれば、モールド成形基板にモールド型で貫通した凹設穴を形成するから凹設穴の深さ設定が金型で自由にでき、品質が安定し生産性が著しく向上する。 また、下方のガラス繊維入り樹脂基板との組み合わせもプリプレグなどの透過しやすい接着材層を介すことなしにモールド樹脂で直接接合できるため、接着材層からの光漏洩がなくなり発光装置に適した凹型反射板(レフレクター)構造となる。 【選択図】 図1
PROBLEM TO BE SOLVED: To solve the problem that it is difficult to keep high efficiency by mounting a light-emitting element in a non-penetrating hole since fine recesses and projections remain on working surfaces of inner walls and the bottom surfaces of recessed holes by drilling or router work in the case of forming a metal plating film surrounding the bottom surfaces, the wall surfaces and the upper surfaces of the recessed holes of a wiring board for improving the connection reliability of a component element or as a reflection surface. SOLUTION: The recessed holes are formed by penetrating a molding substrate with a mold, so that the depth of the recessed hole is set freely by a metallic mold to stabilize a quality and to improve productivity. Moreover, the molding substrate and a lower glass-fiber containing resin substrate are combined by direct joint using a mold resin without interposing an easily permeable adhesive layer such as prepreg, so that light leakage from the adhesive layer is eliminated and the structure of a recessed reflection board (reflector) is obtained suitable for a light emitting device. COPYRIGHT: (C)2007,JPO&INPIT




Download Full PDF Version (Non-Commercial Use)

Patent Citations (1)

    Publication numberPublication dateAssigneeTitle
    JP-2001217464-AAugust 10, 2001Rohm Co Ltd, ローム株式会社発光表示装置およびその製法

NO-Patent Citations (0)


Cited By (2)

    Publication numberPublication dateAssigneeTitle
    CN-105161443-ADecember 16, 2015济南晶恒电子有限责任公司Filling guiding die and filling method of mini chip of diode
    US-8212271-B2July 03, 2012Hitachi Chemical Co., Ltd.Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof